Nova pioneered the field of Integrated Metrology (IM) for thin film measurement on semiconductor wafers and was the first to introduce an IM solution for CMP. Today, Nova’s IM enables high sampling rates of up to 200 WPH while allowing in-die measurements and analysis of complex stacks. Implementing Closed Loop Control (CLC) ensures fewer reworks, increased yield, shorter CMP cycle times and higher throughput.

• High-end metrology and APC for technologies down to 32 nm


• Best fleet-matching with no need for application specific recipe adjustment or calibration


• Unmatched throughput and reliability result in lower CoO


• Full compatibility with Nova’s SA metrology platform enables a mixed solution


• Together with NovaMARS, provides advanced 2D/3D and in-die modeling and measurement


• Offers a wide range of metrology solutions for Etch, Lithography and CMP